Fuji Electric and Infineon Enter Into Agreement to Support Automotive Industry

Manufacturers Agree on Common Footprint for Automotive IGBT Power Modules
Neubiberg and Nuremberg, Germany and Tokyo, Japan, May 10, 2012 – Fuji Electric Co., Ltd., and the chip manufacturer Infineon Technologies AG (FSE/NYSE: IFX) serve the automotive industry by extending the supplier base for power modules deployed in automotive hybrid and electrical vehicles (HEV). Today at the PCIM Europe trade show (Nuremberg, Germany, May 8-10, 2012) the two companies announced their agreement on a joint common footprint for automotive IGBT power modules using the Infineon HybridPACKTM 2 power module. In response to the need for supply security for HEV power modules, Infineon and Fuji Electric agreed on the size of the module, the position of pin-outs, the use of the pin-finned copper base plate and on other mechanical features. The agreement comprises a HybridPACK 2 module, the FS800R07A2E3 module featuring 650V/800A.

“With the world-wide requirements for saving fossil fuel and increasing kilometer-per-liter, the demand for hybrid and electric vehicles will increase further. A reliable dual-source supplier base of power module will be an important foundation for supporting the automotive industry to expand the lineup and the production of hybrid and electric vehicles,” said Toru Hosen, President of the Power Semiconductors division at Fuji Electric Co., Ltd.  “This agreement also enables us to expand our product lineup.”

“In its ambition to make cars clean, safe and affordable Infineon developed power modules to enable the use of hybrid and electrical motors in all vehicle classes,” said Jochen Hanebeck, President of the Automotive division at Infineon Technologies AG. “The combination of our four decades of experience in power electronics and car electronics has resulted in our highly compact and reliable HybridPACK power modules. We are proud to serve the automotive industry with this agreement that caters for a reliable dual-source supplier base.”
The HybridPACK 2 modules of Infineon are available in high-volume. Fuji Electric plans to have power modules with HybridPACK 2 footprint available as of 2013.
About Fuji Electric Corp. of America and Fuji Electric Co., Ltd.
Fuji Electric Corp. of America is a wholly owned subsidiary of Fuji Electric Co., Ltd., and has been responsible for sales and distribution of the company’s products since 1970.  Fuji Electric Co., Ltd. has been developing power electronics equipment since 1923, and is a global leader in industrial products ranging from semiconductors, power supply, and power generation equipment to AC drives and electric vehicle charging stations.  For more information visit www.americas.fujielectric.com

About Infineon
Infineon  Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency , mobility , and security . In the 2011 fiscal year (ending September 30), the company reported sales of Euro 4 billion with close to 26,000 employees worldwide. Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International Premier (ticker symbol: IFNNY). Further information is available at www.infineon.com
Media Contacts:
Doretta Caprarola
Fuji Electric Marketing Manager
(201) 490-3933

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