SCSOA is an abbreviation of Short Circuit Safety Operating Area. During an incident with an inverter device, such as a load short-circuit, arm short-circuit, or ground fault, a current that is several times higher than the rated current flows in the IGBT. SCSOA is provided to protect the IGBT even during these instances. SCSOA has […]
RBSOA is an abbreviation of Reverse Bias Safety Operating Area. The data sheet contains a characteristic graph describing double the rated voltage and rated current under the condition of maximum continuous operation temperature Tj(op). It illustrates a range of VCE and IC where safe operation is maintained when IGBT is turning off. The operation can […]
1 device represents a value per arm (IGBT+FWD). Some models connect multiple chips per arm in parallel. This parallel-chip configuration is counted as one chip.
IPM V-series input control signal is IGBT-on when set at Low. A small IPM’s input control signal is IGBT-on when set at High.
A bootstrap circuit is one that is composed of a control power supply to drive high-side IGBT. It is possible to have a single power supply as it does not require a transformer with multiple secondary windings. Its built-in bootstrap resistance and bootstrap diode (BSD) gives a small IPM to configure a bootstrap circuit simply […]
VDA and VDN use different material for their insulating substrates, resulting in separate thermal resistance values. The VDA type uses aluminum oxide, while the VDN type uses high heat-radiation material, with approximately 30% less thermal resistance than that of VDA. It is effective when achieving a lower Tj max. or longer ΔTj power cycle life […]
It is a pin type that allows PCB mounting without soldering. It is used in PIM and 6-Pack products. The time required for the assembly process is reduced as connection is completed by pressing an IGBT module over PCB’s through-hole and applying pressure from the base side. Special press and press-in tools are required. We […]
The insulated substrate consists of a ceramic substrate, front-surface copper-foil pattern to create a circuit, and back-surface copper-foil to solder with a copper base. It is designed to electrically insulate between the electric part and the part for thermal dissipation. The ceramic substrate materials used are aluminum oxide, aluminum nitride, silicon nitride, etc.
Fuji Electric Corp. of America began manufacturing IGBTs in 1988, and now has nearly 30 years of history in supplying IGBT products to the market.
EMS is an abbreviation of Electro Magnetic Susceptibility. The word describes an electronic device’s capability and performance against surrounding interference, and it is also called immunity. It includes evaluation items such as electromagnetic waves, static electricity, and lightning surge. For details, refer to Application Manual Chapter 10.
