What are the differences between IPMs (Intelligent Power Modules) types?

“Fuji has released products with 2500 V isolation voltage (V-IPM, R-IPM) for general industrial application and Small IPMs with 1500 V isolation voltage for air conditioners. The IPMs for general industrial application have a good heat spread characteristic thanks to a copper base plate, and they have protection functions with on chip temperature and current […]

Can I get dimensions which are not described in the outline drawing included in the data sheet?

For dimensions which are not described in the outline drawing, please contact Fuji Electric Corp. of America or your local sales representative or distributor.

What is the influence on the switching loss Eon if the stray inductance Ls of the main circuit is small?

If the stray inductance Ls of the main circuit is small, VCE voltage drop (ΔV=-LSx di/dt) becomes small and Eon becomes large.

What is the difference between an I-type 3-level module and a T-type 3-level module?

Major circuit configurations of 3-level inverters can be categorized in 2 groups, I-type and T-type as shown in the figure below. Fuji Electric has commercialized a T-type which applies two Reverse Blocking IGBTs (RB-IGBT) as a bi-directional switch. The loss can be made smaller compared with the conventional T-type where diode is connected in series […]

There is a converter circuit in the PIM (Power Integrated Module). How to calculate losses of the diode in the converter circuit?

The average value of diode losses in the converter circuit is obtained from the formula below.

How do I use the equation and table that are attached to the transient thermal resistance curve in the data sheet?

The junction temperature Tvj doesn’t increase immediately when power losses are generated on a semiconductor chip. There is a time delay due to thermal capacity of materials composing the IGBT module. The equation in the data sheet shows the relationship of the transient thermal resistance to the pulse width tw when a single square wave […]

Where is a NTC mounted in a module?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.

What happens to IGBT modules in a case where an application exceeds the ΔTj power cycle capability?

It will cause a separation of aluminum wire, or a crack in the solder under the chip. Thermal destruction will result from the current concentrating on the relevant part of the chip, or increased thermal resistance.

How works a stencil mask to apply thermal compound and can I purchase it from Fuji?

A stencil mask is a 200 μm-thick, metal plate with multiple holes punched in the compound application area. A compound can be applied with a uniform thickness of 100 μm when clamping the stencil to a heat sink after application. We do not sell stencil masks but we can provide a mask drawing that corresponds […]

Can I get a drawing of the internal chip layout to measure the case temperature TC?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.