When you estimate the junction temperature Tvj, please use the chip characteristic data for the calculation.
If roller and/or spatula is used to apply thermal grease, the amount of application may vary or it is impossible to coat the grease evenly. Therefore, those tools are not recommended. Instead, we strongly recommend an application of the grease using stencil masks (See Q40).
It varies depending on conditions such as internal structure of the module, thermal grease and cooling fins. Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.
The temperature of LVIC (low voltage IC for low arm IGBT drive) is detected. It is not the junction temperature of the IGBT.
Fuji recommends the paste ‘G776’. Please contact Shin-Etsu Chemical for details. However, Fuji Electric does not guarantee its characteristics when combined with IGBT module.
They are almost proportional. The switching loss increases as the DC voltage becomes higher.
ΔTj power cycle breakdown mode will become solder degradation mode in the operation with large temperature variation and wire peeling mode in the operation with relatively small temperature variation. Additionally, the transition from plastic to elastic behavior occurs at around 50oC, which causes an inflection point in the curve.
Power cycle capability is the capability of the module to withstand repeated heating and cooling. The case temperature Tc will goes up and down until the modules fails: Stress strain is generated between the metal base plate and the insulating substrate causing fatigue in the solder under the insulating substrate. Refer to technical documents describing […]
For hybrid SiC modules, the same thermal grease used for conventional all-silicon chip IGBT module can also be used.
The average value of diode losses in the converter circuit is obtained from the formula below.
