An IGBT module is broken. How can we investigate the cause?

The breakdown mode of an element may include overcurrent, overvoltage, overheat, etc. Causes of each breakdown mode have to be investigated. In the real world, however, it is difficult to identify the cause by the breakdown status of an IGBT module alone. It is important to consolidate information such as the breakdown voltage VCE, current […]

Which X Series IGBT module power cycle curves ΔTvj, Tvj min=25oC, Tvj max=150oC and Tvj max=175oC should be used for my design?

These are only exemplary temperatures. If they are not suitable for your application, use the curve that gives the shortest lifetime for your design.

What is the power cycle capability ΔTvj?

In operations where the junction temperature Tvj of a semiconductor chip changes, thermal stress is generated between the materials of the power module. Fatigue will be accumulated from repeated thermal stress, leading to breakdown in the end. Increasing temperature change ΔTvj, leads to a reduction in the lifetime of the power module. It is called […]

What is the reason of power cycle capability ΔTj curve bending at 50oC?

ΔTj power cycle breakdown mode will become solder degradation mode in the operation with large temperature variation and wire peeling mode in the operation with relatively small temperature variation. Additionally, the transition from plastic to elastic behavior occurs at around 50oC, which causes an inflection point in the curve.

What is the power cycle capability ΔTc?

Power cycle capability is the capability of the module to withstand repeated heating and cooling. The case temperature Tc will goes up and down until the modules fails: Stress strain is generated between the metal base plate and the insulating substrate causing fatigue in the solder under the insulating substrate. Refer to technical documents describing […]

What happens to IGBT modules in a case where an application exceeds the ΔTj power cycle capability?

It will cause a separation of aluminum wire, or a crack in the solder under the chip. Thermal destruction will result from the current concentrating on the relevant part of the chip, or increased thermal resistance.

Is there ΔTc power cycle curve?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.

Have Fuji semiconductor parts an UL certification?

Power semiconductor modules of Fuji Electric Corp. of America have been certified with UL standard 1557, category code QQQX2 (File No. E82988). The relevant model types can be found on the UL website’s (http://japan.ul.com/) Online Certifications Directory.

Are Fuji semiconductor parts compliant with REACH regulations?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.

Where can we obtain an RoHS Certificate of Conformity (CoC)?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.