What is the power cycle capability ΔTvj?

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In operations where the junction temperature Tvj of a semiconductor chip changes, thermal stress is generated between the materials of the power module. Fatigue will be accumulated from repeated thermal stress, leading to breakdown in the end. Increasing temperature change ΔTvj, leads to a reduction in the lifetime of the power module. It is called as the power cycle capability ΔTvj.

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