Is an evaluation board for the IGBT module available?

A board for characteristic evaluation of the module is available. Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.

How do I set up the shunt resistance for excess current detection of a small IPM?

Please refer to Chapter 4.2 of Application Manual.

Why do the currents balance if IGBTs with positive temperature coefficients are connected in parallel?

“Let’s consider the case where two IGBTs with different VCEsat are connected in parallel. (1) A larger amount of the current will flow through the IGBT with smaller VCEsat. (2) Due to the larger current flow, the total loss of the IGBT becomes large and the junction temperature increase. (3) If the IGBT has a […]

Is the maximum current per pin the same between solder pins and press-fit pins?

They are the same.

What is the maximum current per pin of PIM and 6in1 modules?

For each pin 50 A is the maximum.

What is “short-circuit withstand capability”?

In the case of excess current due to an accident or abnormal operation of an inverter device, the time from the start of the short-circuit current until the IGBT breakdown is called the short-circuit withstand capability. The protection circuit has to be designed to detect excess current in a short time not exceeding the short-circuit […]

Can I get short-circuit withstand capability data?

The short-circuit withstand capability varies with chip generation and withstand voltage. Technical documents that show the relation of the short-circuit withstand capability tSC as a function of DC voltage VCC are available. Please download them from our web site.

Where is a NTC mounted in a module?

Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.

What happens to IGBT modules in a case where an application exceeds the ΔTj power cycle capability?

It will cause a separation of aluminum wire, or a crack in the solder under the chip. Thermal destruction will result from the current concentrating on the relevant part of the chip, or increased thermal resistance.

How works a stencil mask to apply thermal compound and can I purchase it from Fuji?

A stencil mask is a 200 μm-thick, metal plate with multiple holes punched in the compound application area. A compound can be applied with a uniform thickness of 100 μm when clamping the stencil to a heat sink after application. We do not sell stencil masks but we can provide a mask drawing that corresponds […]