For the V Series IPM a connector, MDF-25S-2.54DSA (by HIROSE ELECTRIC CO., LTD.) is recommended for the high capacity type P631. However, this type has 25 poles which does not match with the IPM control pin count of 16. Do you know a connector with poles extracted from positions where the IPM pin is unavailable?

Please contact HIROSE ELECTRIC. CO., LTD.

For thermal calculations of IGBT module, which numeric value should be used, chip or terminal, to estimate/calculate the values of VCEsat and VF?

When you estimate the junction temperature Tvj, please use the chip characteristic data for the calculation.

Can I use roller and spatula for applying thermal grease to an IGBT module, or is there a problem ?

If roller and/or spatula is used to apply thermal grease, the amount of application may vary or it is impossible to coat the grease evenly. Therefore, those tools are not recommended. Instead, we strongly recommend an application of the grease using stencil masks (See Q40).

Are the characteristics of the NTC thermistor built in an IGBT module different depending of the product type? Are there different types for each module?

They are the same. Refer to the Data sheet of each type for resistance value and B constant.

Is the temperature of the NTC thermistor in an IGBT module the same as the heatsink temperature Ts?

The temperature of the NTC thermistor and the heatsink temperature Ts are different.

Is the temperature of the NTC thermistor in an IGBT module the same as the junction temperature Tvj?

The temperature of the NTC thermistor and the junction temperature Tvj are different. The junction temperature Tvj becomes higher than the temperature of the NTC thermistor. The thermistor is mounted on the same insulating substrate as the IGBT chip but is away from the IGBT chip. It follows the junction temperature Tvj with an offset […]

Is the temperature of the NTC thermistor in an IGBT module the same as the case temperature Tc?

The temperature of the NTC thermistor and the case temperature are different. Generally speaking, the case temperature Tc directly under the chip becomes higher than the temperature of the NTC thermistor.

Can we consider that the case side temperature of an IGBT module is the same as the case temperature Tc?

The case side temperature and the case temperature Tc are different. Heat of a semiconductor chip is conducted through an insulating substrate to the copper base and heatsink. The case side temperature becomes considerably low, compared with Tc.

Can we consider that the case temperature Tc is an average value across the copper base plate?

It is not an average value across the copper base plate. It is the case temperature directly under the chip.

Can we assume that the case surface temperature and the case backside temperature of a discrete IGBT the same?

There is a temperature difference between the surface temperature and the backside temperature. The latter becomes higher.