Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.
Fuji Electric Corp. of America enforces the same quality standard for product management at all locations, regardless of where the manufacturing sites are.
The semiconductor products of Fuji Electric Corp. of America are manufactured at its six sites in Japan (including Matsumoto Factory, Yamanashi Factory, Fuji Electric Power Semiconductor Co., Ltd., and Fuji Electric Tsugaru Semiconductor Co., Ltd.), and three overseas sites (Fuji Electric (ShenZhen) Co., Ltd., Fuji Electric Philippines, Inc., and Fuji Electric (Malaysia) Sdn. Bhd.).
Case temperature (Tc) is the temperature on the module copper base surface right under a semiconductor chip where the temperature is the highest.
Junction temperature is the temperature at joints on a semiconductor chip.
An IGBT is a device that has a basic structure of a P-layer added to the drain side of a MOSFET. An IGBT is suited for large-current and high withstand-voltage applications. A MOSFET is suited for small-capacity and high-speed switching applications.
