Yes. The main factors impacting the IGBT module’s life expectancy are temperature gaps involving the element’s junction temperature Tj, and increase and decrease of case temperature Tc. Refer to technical documents describing the relationship of ΔTj and ΔTc with the device life expectancy.
FAQ Categories: Reliability
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What is the piece of black sponge pinned on the module terminals?
The piece of black sponge is attached for protection. Please keep the sponge on the module at the time of storage.
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How do I store semiconductor devices?
The desired storage environment has a temperature range of 5 to 35oC, and humidity range of 45% to 75%. Avoid storage under load, and secure a location with little temperature fluctuation. For details, refer to Application Manual Chapter 3-8.
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Is there any quality difference between products made in Japan and those made overseas?
Fuji Electric Corp. of America enforces the same quality standard for product management at all locations, regardless of where the manufacturing sites are.
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How do I calculate the power cycle in cases where there are multiple temperature rise peaks?
In cases where the temperature increases n-times per device operation cycle, we assign a power cycle life expectance count as PC(k=1, 2, 3, …, n). PC(k) is the power cycle life for the k-th temperature rise. A combined power cycle life expectancy count can be expressed by the formula below.
For details, refer to Application Manual Chapter 11.
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What types of power cycle capability are available?
The types of power cycle capability include the ΔTj power cycle (ΔTj-P/C) capability curve and the ΔTc power cycle (ΔTc-P/C) capability curve. We verify device life on two models, therefore please design a product life expectancy within these power cycle capabilities. For details, refer to Application Manual Chapter 11.
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How should thermal grease (compound) be applied on an IGBT module?
Thermal grease can be applied using either a roller or stencil mask. An inappropriate thermal grease thickness will negatively affect heat radiation to the heat sink. We strongly recommend using a stencil mask that enables a uniform thickness to be applied over the back surface of the module. For details on application methods, refer to Application Manual Chapter 6-3.3 or Mounting Instruction. An optimum outline drawing for each module is also available. Please contact Fuji Electric Corp. of America or your local sales representative or distributor to answer your question.
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Can we apply an IGBT module directly to a heat sink?
No, prior to using an IGBT module, please apply thermal grease (compound) on the surface of a heat sink and module before layering. This will reduce the contact thermal resistance. For details, refer to Application Manual Chapter 6-3.3 or Mounting Instruction.
