Yes. The main factors impacting the IGBT module’s life expectancy are temperature gaps involving the element’s junction temperature Tj, and increase and decrease of case temperature Tc. Refer to technical documents describing the relationship of ΔTj and ΔTc with the device life expectancy.
The piece of black sponge is attached for protection. Please keep the sponge on the module at the time of storage.
The desired storage environment has a temperature range of 5 to 35oC, and humidity range of 45% to 75%. Avoid storage under load, and secure a location with little temperature fluctuation. For details, refer to Application Manual Chapter 3-8.
Fuji Electric Corp. of America enforces the same quality standard for product management at all locations, regardless of where the manufacturing sites are.
In cases where the temperature increases n-times per device operation cycle, we assign a power cycle life expectance count as PC(k=1, 2, 3, …, n). PC(k) is the power cycle life for the k-th temperature rise. A combined power cycle life expectancy count can be expressed by the formula below. For details, refer to Application […]
The types of power cycle capability include the ΔTj power cycle (ΔTj-P/C) capability curve and the ΔTc power cycle (ΔTc-P/C) capability curve. We verify device life on two models, therefore please design a product life expectancy within these power cycle capabilities. For details, refer to Application Manual Chapter 11.
Thermal grease can be applied using either a roller or stencil mask. An inappropriate thermal grease thickness will negatively affect heat radiation to the heat sink. We strongly recommend using a stencil mask that enables a uniform thickness to be applied over the back surface of the module. For details on application methods, refer to […]
No, prior to using an IGBT module, please apply thermal grease (compound) on the surface of a heat sink and module before layering. This will reduce the contact thermal resistance. For details, refer to Application Manual Chapter 6-3.3 or Mounting Instruction.
